Jiangsu Silicon Integrity Semiconductor Technology Co., LTD(JSSI) mainly focus on mobile products, offering a turnkey high-tech middle-end, back-end packaging and test service for customers. JSSI is committed to be the world-class leading high-tech packaging and test center for Bumping, WLCSP, Flip Chip PKG, QFN, BGA, SIP, SIP-LGA, BGA, FOWLP, 2.5D/3D, Chiplet PKG R&D and manufacture. The first phase operates 54,000 m2 standardized industry factory, and mainly carrier out the high-tech CSP packaging and development. And second phase plan to build up a CSP packaging and test base, covering an area of about 100,000 m2. JSSI owns world-class packaging and design capabilities, including mask, laminate, lead frame designs and simulation capability, also the management and R&D team has been working in the integrated circuit industry for more than 20 years, to be a leading global packaging and test provider to customers in China and around the world.