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About Us
Jiangsu Silicon Integrity Semiconductor Technology Co., LTD(JSSI) mainly focus on mobile products, offering a turnkey high-tech middle-end, back-end packaging and test service for customers. JSSI is committed to be the world-class leading high-tech packaging and test center for Bumping, WLCSP, Flip Chip PKG, QFN, BGA, SIP, SIP-LGA, BGA, FOWLP, 2.5D/3D, Chiplet PKG R&D and manufacture. The first phase operates 54,000 m2 standardized industry factory, and mainly carrier out the high-tech CSP packaging and development. And second phase plan to build up a CSP packaging and test base, covering an area of about 100,000 m2. JSSI owns world-class packaging and design capabilities, including mask, laminate, lead frame designs and simulation capability, also the management and R&D team has been working in the integrated circuit industry for more than 20 years, to be a leading global packaging and test provider to customers in China and around the world.


The company was formally established on Sep 11th 2020


54000 square meters standardized fab environment


“One Hour” To Nanjing Lukou International Airport

“One Hour”To Shanghai

“Three Hour”To Beijing